The Basic Physical Processes that Control Spin Coating


The Spin Coating Process can be broken down into several key stages: fluid dispense, spin-up, stable fluid outflow, and finally evaporation dominated drying. Click Here for Details

Fluid Flow on a flat spinning substrate is one of the most important physical processes involved in spin coating. Click Here for Details

Air Flow above the spinning wafer is also very important since this exerts most control over the evaporation rate of solvent from the solution. Click Here for Details
 


Dunbar P. Birnie, III
Professor
Department of Materials Science and Engineering
University of Arizona

Major revisions installed in July 2000
Updated in October 1998 and December 1999.
Page started 1 May 1998
(c) 1998,1999,2000, D. P. Birnie, III