MSE 465/565

Materials Science and Engineering

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MSE/ECE 465/565
Microelectronic Packaging Materials
Spring Semester

2001-2002 Catalog Data: MSE 465 Microelectronic Packaging Materials (3) II Design of microelectronic packaging systems based on the electrical, thermal and mechanical properties of materials. Chip, chip package, circuit board and system designs are considered. May be convened with MSE 565.

Instructor:

Dr. Dunbar Birnie, Professor of Materials Science and Engineering

Textbooks:

Microelectronics Packaging Handbook, ed. by Rao R. Tummala, Eugene J. Rymazewski, and Alan G. Klopfenstern, Chapman Hall, New York, 1997.

Overall Educational Goals:

Microelectronic packaging is the science and art of interconnecting and providing a suitable environment for electrical circuits. The four major functions of an electronic package are: power distribution, signal distribution, heat dissipation and circuit protection. The packages and processing of materials used in microelectronic packaging today limit the performance of packages in all of these areas. This course will deal with the design considerations, based on electrical, thermal and mechanical properties of materials, which lead to present commercial packaging systems at the chip, chip package, circuit board and system levels.

Course Topics:

Introduction and Overview
Plastic Packages
Chip to Package Interconnections
Ceramic Packages
Sealing and Encapsulation
Printed Wiring Boards
Thin Film Packaging
Coated Metal Boards
Electrical Design
Wiring and Terminals
Heat Transfer
Reliability
Package to Board Interconnections
Package Manufacture

Assessment of Course Goals:

Quizzes	15% each
Final Exam	30%
Design Project	40%

Design Project

There will be a design project carried out in groups of three students. The major emphasis of the design will be on the materials and processing involved in a package, but there are critical electrical, thermal and layout aspects to the design. A brief written progress report and an oral report will be required twice during the semester. The end product will be an oral presentation and a final written report due at the end of the semester.

Contribution to Professional Component:

Engineering Design, 3 credits

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